On the Design of RF Spiral Inductors on Silicon
نویسندگان
چکیده
This review of design principles for implementation of a spiral inductor in a silicon integrated circuit fabrication process summarizes prior art in this field. In addition, a fast and physics-based inductor model is exploited to put the results contributed by many different groups in various technologies and achieved over the past eight years into perspective. Inductors are compared not only by their maximum quality factors ( max), but also by taking the frequency at max, the inductance value ( ), the self-resonance frequency ( SR), and the coil area into account. It is further explained that the spiral coil structure on a lossy silicon substrate can operate in three different modes, depending at first order on the silicon doping concentration. Ranging from high to low substrate resistivity, inductor-mode, resonator-mode, and eddy-current regimes are defined by characteristic changes of max, , and SR. The advantages and disadvantages of patterned or blanket resistive ground shields between the inductor coil and substrate and the effect of a substrate contact on the inductor are also addressed in this paper. Exploring optimum inductor designs under various constraints leverages the speed of the model. Finally, in view of the continuously increasing operating frequencies in advancing to new generations of RF systems, the range of feasible inductance values for given quality factors are predicted on the basis of optimum technological features.
منابع مشابه
An Efficient Technique for Substrate Coupling Parasitic Extraction with Application to RF/Microwave Spiral Inductors (RESEARCH NOTE)
This paper presents an efficient modeling method, based on the microstrip lines theory, for the coupling between a substrate backplane and a device contact. We derive simple closed-form formulas for rapid extraction of substrate parasitics. We use these formulas to model spiral inductors as important substrate-noise sources in mixed-signal systems. The proposed model is verified for the freque...
متن کاملDesign and Fabrication of High-Q Spiral Inductors Using MEMS Technology
This paper presents the design and modeling, fabrication and characterization of suspended spiral inductors on silicon substrate. The substrate materials underneath the inductor coil are removed by micromachining process to reduce the substrate loss which enables high frequency operation. A complete Library of spiral inductors with different line width, line spacing and number of turns have bee...
متن کاملThrough-Silicon-Via Inductor based DC-DC Converters: The Marriage of the Princess and the Dragon
There has been a tremendous research effort in recent years to move DC-DC converters on chip for enhanced performance. However, a major limiting factor to implement on-chip inductive DC-DC converters is the large area overhead induced by spiral inductors. Towards this, we propose to use through-silicon-vias (TSVs), a critical enabling technique in three-dimensional (3D) integrated systems, to i...
متن کاملSystematic Analysis and Modeling of Integrated Inductors and Transformers in RF IC Design
An efficient modeling technique and a novel CAD tool for the accurate prediction of the performance of integrated inductors and transformers is presented. This generic and process-independent approach generates lumped-element models that easily plug into the RF IC design flow. Their accuracy is established through comparisons with measurements of numerous fabricated inductor structures. This pa...
متن کاملOn-Chip Spiral Inductors Suspended over Deep Copper-Lined Cavities
A silicon micromachining method has been developed to fabricate on-chip high-performance suspended spiral inductors. The spiral structure of an inductor was formed with polysilicon and was suspended over a 30m-deep cavity in the silicon substrate beneath. Copper (Cu) was electrolessly plated onto the polysilicon spiral to achieve low resistance. The Cu plating process also metallized the inner ...
متن کامل